DuPont offers a robust, production-proven photoresist product line for semiconductor manufacturing processes, from 365nm down to 13.5nm wavelengths, and exposures that achieve features from 280nm to 20nm, from our i-line/g-line, to our 193 and KrF product families, combined with DuPont’s etching, developing and ancillary products.
Thin film etchants
Transene offers a large range of thin film etchants: Al, Al2O3, BOE, Cr, Cr-Si, Cr-SiO, Cu, GaAs, GaN, Ga2O3, GaP, Ge, Au, Hf, HfO, In2O3, ITO, InP, Fe2O3, Polyimide, MgO, Mo, Nb, NbN, NbO, Ni-Cr, Ni, Ni-V, Pd, Pd, Ru, Si, SiC, SiO2, SiO, Si3N4, Ag, Acier inox, Ta, Ta3N5, Ta2O5, TaSi, Sn, SnO, Ti, TiN, Ti-W, W, SnO
Semiconductor Packaging Materials
DuPont develops new materials to meet ever changing requirements, from workhorse packages like flip-chip technologies to emerging technologies like fan-out WLP and TSVs. DuPont is a technology leader in electroplating materials used for UBM, RDL, Cu pillars, and solder bumps, along with polymers and dielectrics for RDL, photoresists and TSV fill.