SU-8 negative epoxy-based photoresist
SU-8 is a high contrast, negative epoxy-based photoresist designed for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired. The exposed and subsequently cross-linked portions of the film are rendered insoluble to liquid developers. SU-8 has very high optical transparency above 360 nm, which makes it ideally suited for imaging near vertical sidewalls in very thick films. SU-8 is best suited for permanent applications where it is imaged, cured and left in place.
KMPR® 1000 i-Line epoxy based photoresist
KMPR® 1000 i-Line photoresist is a high contrast, epoxy based photoresist that can be developed in a conventional aqueous alkaline developer (TMAH). KMPR® 1000 is designed to coat 4-110 µm in a single step using five standard viscosities.
KMPR® 1000 can be easily removed after completion of electroforming using commercially available chemical removers. Lithography can be used to form KMPR® 1000 molds that have the required dimensional accuracy and sidewall verticality for micro electroforming.
Deep reactive ion etching (DRIE) compatible with the CMOS process, KMPR® 1000 will survive dry etch for the extended periods of time necessary to perform >20 µm deep etching with HAR.
PermiNex® 1000 and 2000 Wafer Bonding Adhesives
Kayaku Advanced Materials, Inc. PermiNex® 1000 and 2000 resists are epoxy based, photo-imageable bonding resist used as an adhesive layer for the definition and capping of cavity structures such as BAW, SAW, microfluidic devices, and others, where critical alignment, low temperature processing and high bond quality are desired.
KMSF® 1000 Low Stress Dielectric Photoresist
KMSF® 1000 is a negative tone, polyimide-based photo-dielectric for use as an ultra-low stress buffer, passivation or protective layer.