Meeting Generations of Lithography Process Requirements
DuPont offers a robust, production-proven photoresist product line with materials options that meet the requirements across generations of lithography processes from 365nm down to 13.5nm wavelengths, and exposures that achieve features from 280nm to 20nm. The quest to achieve ever smaller technology nodes means photoresists must offer higher and better resolution with a wider depth of focus, with fewer defects. At the same time, legacy nodes rely on tried and true formulations. From i-line/g-line, to 193 and KrF product families, DuPont has photoresists to match your needs. When combined with DuPont’s etching, developing and ancillary products, you get a total materials solution to support your semiconductor manufacturing processes. DuPont broad portfolio also allows us to tailor photoresists to meet specific customer specifications:
DuPont i-Line Products (365nm) SPR™ and MCPR™ photoresists are formulated to support different thickness requirements while achieving high resolution and low defects. DUV Products (248nm) photoresists show excellent product performances with low defects for various applications.
EPIC™ Photoresists are a series of 193 resists widely used for 193 processes with and without topcoats. DuPont’s EPIC™ IM Resist is designed for the unique environment created by immersion lithography, in which water between the lens and the wafer enables exposure of finer patterns.