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Kayaku Lift-off Resists

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PMGI and LOR underlayers for high yield, bi-layer metal lift-off processes. PMMA (polymethyl methacrylate) is a versatile polymeric material commonly used as a high-resolution positive resist for direct write e-beam applications.

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product exposure resolution applications developer thinner stripper datasheet

LOR & PMGI

top-imaging resist: g-, i-line, DUV, 193nm & e-beam

sub 0.25 µm

metal lift-off , release layers

TMAH

*

Remover PG

PMMA & Copolymer MMA (8.5) MAA

E-beam, X-ray

high

e-beam, ML T-gate

MIBK/IPA

*

Remover PG

*dedicated thinner available on request for each product.

LOR & PMGI Lift-off Resists

PMGI and LOR resists enable high yield, metal lift-off processing in a variety of applications from data storage and wireless ICs, to MEMS. Used beneath photoresists in a bi-layer stack, PMGI and LOR extend the limits of lift-off processing beyond where single layer resist strategies can reach. This includes very high resolution metallization (<0.25µm), as well as very thick (> 3µm) metallization. These unique materials are available in a variety of formularies to meet virtually any customer need.

PMMA & Copolymer Positive Resists

PMMA (polymethyl methacrylate) is a versatile polymeric material that is well-suited for many imaging and non-imaging microelectronic applications. PMMA resists are simply PMMA polymer dissolved in a solvent like anisole (safe solvent). Exposure causes scission of the polymer chains. PMMA is most commonly used as a high resolution positive resist for direct write e-beam offering extremely high-resolution, ease of handling and excellent film characteristics. PMMA is also used as a protective coating for wafer thinning, as a bonding adhesive and as a sacrificial layer.

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