All thermal interface materials from Indium Corporation are metal-based, which means they have a very high conductivity as compared to polymer-based thermal interface materials. Indium metal, for example, has a conductivity of 86W/mK and is 4 times softer than lead. Its ductility and thermal conductivity make it ideal as a compressible thermal interface material.
HSMF and HSMF-OS
m2TIM™ & Liquid Metal
Liquid Metal: Alloy systems that are liquid at room temperature have a high degree of thermal conductivity far superior to ordinary nonmetallic liquids. This results in the use of these materials for specific heat conducting and/or dissipation applications. Other advantages of these liquid alloy systems are their inherent high densities and electrical conductivities.
m2TIM™ is a unique solid/liquid hybrid thermal interface material that combines liquid metal with a solid metal preform to provide reliable thermal conductivity while eliminating the need for a solderable surface.
Indium Corporation’s Solder Thermal Interface Materials radically improve:
Heat dissipation efficiency in electronic devices
Thermal conductance for high power devices – with densities in excess of 1000 watts
End-of-life performance at the thermal interface – to avoid failures common with fluidic solutions such as greases
Portable device battery performance – by reducing thermal resistance and cooling fan size
Portable device use profile – by reducing heatsink size and mass
Compliance with RoHS while accommodating step soldering requirements