Solder Paste

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As a leader in soldering technology, Indium Corporation offers a number of solder pastes for assembly with many different alloy choices and flux technologies to solve many of your process challenges such as miniaturized components, fine-pitch, voiding, printing and reflow performance.

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Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing industry. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes – coupled with world-renowned technical support – allow for the lowest total cost of ownership and fewer end-of-line defects.

Lead Free Solder Pastes

Indium offers a large range of lead-free solder pastes with a variety of SAC alloys. From the industry standard SAC305 to lower silver contents SAC such as SAC0307, SAC105, SACm (doped), as well as new alloys such as Indalloy®292 engineered to provide advanced reliability for high-performance applications.

Name Alloy Cleanability Flux type Process Features Datasheet

Indium8.9HF

SAC

No-Clean

ROL0

Printing

Best all-around halogen-free solder paste.

Indium10.8HF

SAC

No-clean

ROL0

Printing

Addresses non-wet opens (NWOs)

Indium8.9HF

Indalloy®292

No-clean

ROL0

Printing

Hi-Reliability thermal cycling at -40/150°C , high shear strength, enhanced SIR

Indium10.8HF

Durafuse™ LT

No-clean

ROL0

Printing

High reliability low temperature peak reflow < 210°C

Indium12.8HF

SAC

No-clean

ROL0

Jetting & dispensing

Optimized for long-term jetting and microdispense applications

Indium3.2HF

SAC

Water soluble

ORH0

Printing

Water-wash solder paste

Lead Containing Solder Pastes

Name Alloy Cleanability Flux type Process Features Datasheet

NC-SM92J

SnPb

No-Clean

ROL0

Printing

Industry leading SnPb solder paste. Optimized for ICT.

NC-SMQ92H

SnPb

No-Clean

ROL0

Printing

Industry leading SnPb solder paste. Optimized printing performance.

Indium6.6HF

SnPb

Water-Soluble

ORH0

Printing

Low voiding water soluble solder paste

NC-SMQ51SC

SnPb & SAC

No-clean

ROL1

Printing

Exceptional stencil life and tack strength. Consistent ultra-fine pitch print definition

RMA-155

SnPb & Pb-free

RMA

ROL0

Printing

Hi performance and ideal for mixed alloy SnPb and Pb-free processes

NC-SMQ80

InPb

No-Clean

ROL0

Printing

Designed for Indium based alloys. Reduced leaching/scavenging on gold or silver.

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If you need any assistance or have queries regarding our company or products, please do not hesitate to contact us.
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