Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing industry. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes – coupled with world-renowned technical support – allow for the lowest total cost of ownership and fewer end-of-line defects.
Lead Free Solder Pastes
Indium offers a large range of lead-free solder pastes with a variety of SAC alloys. From the industry standard SAC305 to lower silver contents SAC such as SAC0307, SAC105, SACm (doped), as well as new alloys such as Indalloy®292 engineered to provide advanced reliability for high-performance applications.
Lead Containing Solder Pastes