WBR Series Dry Film Photoresists for Wafer Bumping
Request a sampleWBR Dry Film Photoresists for Wafer Bumping deliver excellent performance in both photo stencil and electroplating processes, and are available in a range of 50-120 microns thicknesses.
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Advanced Packaging Product Benefits:
Higher yield and quality through uniform resist thickness across the entire wafer
Higher productivity without need for drying or double coating; no edge bead removal
Low waste generation with up to 73% yield polymer use
Environmental benefits from reduced material wastage and a solvent free process
WBR2000 Series
WBR 2000 dry film photoresists are high resolution, multi-purpose films compatible with lead-free electroplating and stencil printing applications. These films are available in 50, 75, 100 and 120 micron thicknesses.
Product Features:
Negative working, aqueous, processable polymer film
High aspect ratio resolution
Suitable for in-via and mushroom electroplating bumping applications
Suitable for copper pillar and other lead free applications
High heat resistance for stencil printing bumping applications