Electrolytic copper plating

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DuPont’s longstanding expertise in copper plating is an excellent match for the demands of high density pcb including rigid-flex . DuPont is committed to providing solutions that will enable high performance in any design configuration. Our highly conductive copper metallization is compatible with roll-to-roll processing and low-stress for long-term durability.

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Copper plating & via filling

Current Designation Features

Pulse

COPPER GLEAM PPR

High productivity

Pulse

COPPER GLEAM CUPULSE

High aspect ratio (~15)

Direct

COPPER GLEAM PC

Simplicity of analysis and control (mono additive)

Direct

COPPER GLEAM CLX

Excellent properties with large process window

Direct

ELECTROPOSIT 1300

Designed for compatibility with direct plate. Easy control with Hull cell.

Direct

COPPER GLEAM HT55

Excellent distribution and elongation

Direct

COPPER GLEAM HGX

Very high ductility, flex circuits, soft materials

Direct

MICROFILL EVF

Small holes and blind vias

Direct

MICROFILL THF

designed to provide through hole fill

Additional products and information

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