PCB
Metallisierung
Oberflächenbehandlung
3D-MID
Metallization chemistry for 3D Molded Interconnect Device (MID) technology
Leistungselektronik
ALN paste system
Functional ceramic materials for Aluminium Nitrade substrate
PCB
Bildübertragung
Metallisierung
Developer, Stripper & ancillaries
DuPont Electronic Solutions compliments its range of photo imageable products with a wide range of supporting products for developing, etching and stripping processes.
Microelectronics
DuPont Photoresists
DuPont offers a robust, production-proven photoresist product line for semiconductor manufacturing processes, from 365nm down to 13.5nm wavelengths, and exposures that achieve features from 280nm to 20nm, from our i-line/g-line, to our 193 and KrF product families, combined with DuPont’s etching, developing and ancillary products.
PCB
Reinigung
DuPont™ Sontara® Wipes
Unlike many nonwoven fabrics, Sontara® uses no binders, chemicals or adhesives. It has exceptional mechanical strength, excellent absorbency, and because the fibers are washed during fabric formation, it exhibits very low lint.
PCB
Metallisierung
Electrolytic copper plating
DuPont electrolytic copper plating and via filling advanced chemistry
PCB
Metallisierung
Inner layer bonding
Dupont treatment etch are formulated to produce a uniform, highly-textured and passivated surface coating on copper innerlayers.
PCB
Bildübertragung
Chemisches Formätzen
Liquid photoresist
DuPont Photoposit™ range of negative and positive liquid photoresists enable uniform thin coatings for improved surface conformance, fine-line etching performance, as well as lower costs and reduced waste.
PCB
Metallisierung
Making hole conductive
DuPont longstanding expertise in electroless copper plating solutions
PCB
Metallisierung
PCB final finishes
ENIG, ENEPIG, Tin and SnPB high performing PCB latest final finish product from DuPont Electronic Solutions.
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