Dupont metallization expertise provide a complete metalisation process for 3D-MID Technology, enabling highly integrated electronic 3D molded interconnect device (MID) technology. Through laser direct structuring, conductive traces can be produced on the surfaces of injection-molded parts. This provides a unique way of integrating mechanical and electronic functions on a molding.

Have a question? Get in touch

Additional products and information

Have a question?

If you need any assistance or have queries regarding our company or products, please do not hesitate to contact us.
  • Dieses Feld dient zur Validierung und sollte nicht verändert werden.