PCB
Metallisierung
Oberflächenbehandlung
3D-MID
Metallization chemistry for 3D Molded Interconnect Device (MID) technology
Leistungselektronik
ALN paste system
Functional ceramic materials for Aluminium Nitrade substrate
Leistungselektronik
Alu, Glass & Steel paste systems
Aluminium, Glass, Steel special thick film paste system
Leistungselektronik
Bonding wires
Silver, Copper & Gold bonding wires
PCB
Equipment
BURKLE Lamination Presses
The relevance of PCB production is also growing with the advancing digitalisation as the use of PCB extends to all areas of life. Almost every electronic device today contains one or more printed circuit boards. For more than 45 years already, BÜRKLE has been serving PCB manufacturers worldwide as a line manufacturer with advanced laminating technologies and is always one step ahead of the times.
Wood & Glass
BÜRKLE Surface Finishing Systems
With modern and innovative technologies, BÜRKLE provides you with high quality solutions for the finishing (laminating, lacquering, printing...) of the surfaces of wood-based panels.
PCB
Bildübertragung
Equipment
CAI dual-sided soldermask coating
Circuit Automation designs and manufactures the world’s finest dual-sided soldermask coating and vertical drying equipment. Since 1981, we have served the printed circuit industry with highly reliable innovative machinery, engineered to exceed expectations.
Microelectronics
PCB
Reinigung
Chemisches Formätzen
Cleanroom supply
Wide selection of cleanroom supplies including Lab Coats, Coveralls, Bouffant Caps, Shoe Covers, Gloves, Tacky Mats, ESD and more.
Leistungselektronik
Conductors
Micromax™ has a broad offering of conductors including Platinum, Silver and gold-based alloys (Pd and Pt) conductors
CTS- PCB – Equipement de cuisson IR ou UV ou de séchage
Nous proposons des fours de cuisson pour masques de soudure: Equipements de cuisson infra-rouge. Equipements de cuisson UV. Equipements de cuisson à air chaud
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