Sérigraphie : semi-automatique Unostar E et Mod. EM 2 XP.

Sérigraphie : double face verticale


Introduction to Circuit Automation Global Leader in LCL (LPI) Applications

Established in 1981, Circuit Automation specializes in LPI application equipment. Headquarters:  Huntington Beach, California - Sales Office: Essex, Massachusetts Proudly Made in USA. Circuit Automation designs, and manufactures all equipment at our Huntington Beach factory in California.
Our products are marketed throughout the world.  No Compromise.  The quality is the priority. Only globally accepted parts are used.

                     1. LPI Coating Equipment Double Side Screen Printing _ DP3500, DP2500, DP1500, DP6000

                     2. LPI Drying Equipment _ TC150, HC340

                     3. Material Handling Equipment

                     4. LPI Production/Process Consulting

                     5. Via Hole Plug Equipment

                     6. Vacuum Chambers _ DP-VDM

DP-3500 Smart Print System

Refined and improved LPI coater featuring SPS

Precisely and reliably coating finest micro-thin flexible substrates through the thickest back panels

DP-2500V4.5 Thin Substrate Coater

Versatile Semi-Auto Solution.  FPC to Rigid PCBs  from 15um ~  2mm thick*

The same coater used for DP-6000 systems, our most advanced fully automated systems.

*Other dimensions available upon request



DP-1500 Semi-Automatic Coaters

  • Still Popular Long Seller _ Since 1995.
  • For Standard PCBs 1 mm ~ 1.6 mm thick*
  • Compact and Simple Design

*Other dimensions available upon request

The Industry Standard for all rigid PCB requirements from Thin PCBs to Thick Back-panels.





HC-Series Top Hanging Ovens _ Combi-Ovens
From FPCs to Rigid PCBs
Meets Thin and Double-Sided  Requirement

Our most flexible ovens don’t just do flexible.
From FPCs, Thin PCBs, to the Biggest Back-panels

DP-6000-FL Fully Automatic Coaters

For High-End LPI Automations

Smartphones, LPI on FPC, HDI, etc

FPCs down to 15 um





Today, LCL (LPI) Soldermask makes it a cost-effective alternative to conventional cover-lay films and an answer for the fine pitch requirements of today’s leading edge flexible circuits. Today’s LPI solder-masks meet or exceeds IPC SM 840C, Bellcore TR-NWT-000078 and MIL P55110D specifications.


Replaces a time and energy consuming step cure with a 5-10 minute vacuum process

Drastically reduces micro-bubbles in the solder mask


Holding Station

Hanging Racks for Extremely Thin Material