Standard and emerging semiconductor assembly
Semiconductor and advanced assembly materials (SAAM) are designed to enable a semiconductor chip to communicate with the outside world. We propose a range of solutions used in the manufacture of mobile devices, automotive electronics, avionics, server farms, and power handling for renewable energy sources.

 

2.5D and 3D chip-stacking

•    Wafer bumping fluxes
•    Wafer bumping solder pastes
•    Copper pillar flip-chip fluxes
•    Standard flip-chip fluxes

Flip-chip

•    Standard flip-chip fluxes
•    Wafer bumping and substrate-bumping solder pastes

Wafer level CSP ball mount

•    WL-CSP ball-attach fluxes
•    Specialty solder spheres

Ball-attach

•    Ball-attach fluxes
•    Specialty solder spheres

Package-on-package and fine-pitch component attach

•    PoP pastes
•    PoP fluxes

Specialty component attach

•    Epoxy fluxes

 

 

 

 

 

 

 

 

 


Power semiconductor

Soudure de puces: Die-attached

•    Pb et AuSn
•    Sans Pb: BiAgX, Sn/Sb, SnAg5...
•    Formes: Crème, préforme, sphère, fil, ruban...

Crèmes et flux:

PoP, HF ou halogénés  • Trempé, sprays

Flip chip, 2.5D et 3D, ball-attached

Crème de frittage Ag:    Silver sintering

Joint haute température

Procédé basse temp, sans pression


There are other specialty assembly materials that are used in a variety of different applications, such as solder spheres, as well as gold-tin and indium-containing solder pastes, wire, and preforms.

Read more: http://www.indium.com/semiconductor-and-advanced-assembly/#ixzz2e6PuS5Q2