• Ohmex AG : Thermosetting Silver for Ohmic Bonding to Semiconductors
  • Silver Epoxy Paste: A screenable silver epoxy preparation for developing high quality electrical and mechanical contacts – used in bonding semiconductors and other devices in hybrid microelectronic circuits.
  • Silver Met: Silver-filled, air-drying polymer formulations designed to provide high conductivity metallizations on plastics, paper, mica, ceramic and other non-conductive materials.
  • Silver Bond: Epoxy silver compositions for conductive bonding in microelectronic assembly applications
  • Microcircuit Silver: One-part thermosetting silver epoxy systems for conductive bonding in microelectronic assembly operations.
  • Gold Epoxy Paste: THERMOSETTING GOLD FOR OHMIC BONDING. Produces quality electrical and mechanical contacts for semiconductor and hybrid circuits applications.