Solder mask is available into liquid form or dry film for three application ways:

-by screen printing

-by curtain or spray aplication

-by lamination (dry film)

ELPEMER®photoimageable solder resists

General characteristics

• excellent printing properties, even in the case of high conductors

• enable so-called mass soldering and selective soldering at the same time

• absolutely non-bleeding

• for rigid and flexible circuits

• low solvent content (low VOC; VOC = Volatile Organic Compound), high solids content

• excellent adhesive strength.

Special characteristics of the ELPEMER photoimageable solder resists

• virtually vertical sidewalls enable the representation of finest structures, for instance 50 m solder dams between SMD pads

• very short processing times

• very high processing reliability

• very low exposure energy

• aqueous-alkaline or polyalcohol developable

• good thermal cycling resistance and high temperature resistance

• compatible with lead-free soldering processes

• best resistance to electroless and electro plating finish processes

• approval: best flame class V-0 acc. to UL 94, UL File No. E80315

• meet IPC-SM-840D specification

• mould-resistant in accordance with IPC-TM-650, 2.6.1, and DIN IEC 60068-2-10

Dry film soldermask:

Référence Description Nom Ep.
Conformask 2500
  • Solder Mask permanent sur substrat rigide époxy et polyimide, cuivre ou étain-plomb
  • Excellente résolution
  • Haute brillance
  • Exposition rapide
  • Résistance à la rayure
  • Conformance
  • UL-94VO
CM 2523 58µm
Dynamask 5000
  • Solder Mask permanent sur substrat rigide époxy et polyimide, cuivre ou étain-plomb
  • Excellente résolution
  • Haute brillance
  • Exposition rapide
  • Résistance à la rayure
  • UL-94VO
Dynamask 5030 75µm