CTS offers a large ranges of positive resins for microelectronics applications with

  • Excellent adhesion and abrasion resistance
  • Excellent coating distribution
  • Available in various viscosities

Name

Spectre*

Resolutions

Application

Properties

Developer
and striper

S1800 G2

G, H et I
I optimum

~1 µm

spin coating

 

 

SPR700

G, H et I
I optimum

~1 µm

spin coating

High thermal resistance (~130°C)

 

SPR220

G, H et I
I optimum

~1 µm (1.2)

spin coating

Wet or dry etch, no cracks on Au, Cu, Ni/Fe, fast exposure

MIF or MIB developer

SPR955 CM

G, H et I
I optimum

~ 0,35 µm

spin coating

High line density

0.24N or 0.26N developer (0.26N recommanded)

Ultra I123

I-line

~0,25µm

spin coating

High line density

0.26N developer 

EXP1620

I-line

 

spray or dip

High photo sensitivity, flexible for coating on flexible substrates

160 developer 

SP25

G, H et I

 

spin coating

 

160 developer 

 

SPR505

G, H et I
I optimum

< 1 µm

spin coating

 

MF developer 

PMMA/Copolymer

E-beam, DUV, X-ray

 

spin coating

Excellent adhesion to most substrates, direct-write e-beam lithography, T-gate multi layer processes

MIBK/IPA (1:1 ; 1:2 ; 1:3)
Pure MIBK

Microspray

I-line

 

spray

Ideal for irregular surface, complexes topographies, v-groove, vias and other MEMs structures

MF26A

*LEGEND : e-beam/ DUV=Deep UV=248nm / I-line: 365nm / g-line : 436nm / h-line : 405nm

 

PMMA Positive Resists

PMMA (polymethyl methacrylate) is a versatile polymeric material that is well-suited for many imaging and non-imaging microelectronic applications. PMMA resists are simply PMMA polymer dissolved in a solvent like anisole (safe solvent). Exposure causes scission of the polymer chains. PMMA is most commonly used as a high resolution positive resist for direct write e-beam offering extremely high-resolution, ease of handling and excellent film characteristics. PMMA is also used as a protective coating for wafer thinning, as a bonding adhesive and as a sacrificial layer.

Material uses:

Material attributes:

  • Wafer thinning
  • Protective coatings
  • PHEMT
  • Multi-layer T-gate processes
  • Other direct-write e-beam processes
  • Positive tone
  • E-beam and X-ray imageable
  • Wide range of film thicknesses
  • Resist developers and strippers
  • Excellent adhesion to most substrates

Copolymer resists are based on a mixture of PMMA and ~8.5% methacrylic acid. Copolymer MMA (8.5) MAA is commonly used in combination with PMMA in bi-layer lift-off resist process where independent control of CD size and shape of each resist layer is required. Standard copolymer resists are formulated in ethyl lactate and are available in a wide range of film thicknesses. All MCC PMMA and copolymer resists are available in package sizes from 500ml to 20 liters.

Material uses:

Material attributes:
  • Multi-layer T-gate processes
  • Other direct write e-beam processes
  • Compatible with multi-layer processes
  • Excellent adhesion to most substrates

Schematic of a T-gate illustrating various product layers

 

MicroSpray Photoresist

MicroSpray is a positive acting, aerosol resist, well suited for a broad range of lithographic purposes. This cost effective, easy to use, spray-can eliminates many of the process problems associated with spin coating thick resists and non-planar substrates such as those found in MEMs, Opto-electronics and other non-standard applications.

APPLICATIONS

PRODUCT ATTRIBUTES
  • Conformal coatings
  • Ideal for perforated, small, large & irregular shaped substrates
  • Backside wafer coatings
  • Severe topography, v-grooves, vias & other MEMs structures
  • Microfluidic electrophoresis analysis (Lab-on chip)
  • Multi purpose resist product - excellent R&D tool
  • Very low cost of ownership - no expensive coating equipment required
  • Thick resist coatings demonstrated from 6- 16μm
  • Compatible with MIF and metal-ion aqueous developers
  • High throughput for thick films