CTS offers a large ranges of positive resins for microelectronics applications with
- Excellent adhesion and abrasion resistance
- Excellent coating distribution
- Available in various viscosities
Name |
Spectre* |
Resolutions |
Application |
Properties |
Developer |
S1800 G2 |
G, H et I |
~1 µm |
spin coating |
|
|
SPR700 |
G, H et I |
~1 µm |
spin coating |
High thermal resistance (~130°C) |
|
SPR220 |
G, H et I |
~1 µm (1.2) |
spin coating |
Wet or dry etch, no cracks on Au, Cu, Ni/Fe, fast exposure |
MIF or MIB developer |
SPR955 CM |
G, H et I |
~ 0,35 µm |
spin coating |
High line density |
0.24N or 0.26N developer (0.26N recommanded) |
Ultra I123 |
I-line |
~0,25µm |
spin coating |
High line density |
0.26N developer |
EXP1620 |
I-line |
|
spray or dip |
High photo sensitivity, flexible for coating on flexible substrates |
160 developer |
SP25 |
G, H et I |
|
spin coating |
|
160 developer
|
SPR505 |
G, H et I |
< 1 µm |
spin coating |
|
MF developer |
PMMA/Copolymer |
E-beam, DUV, X-ray |
|
spin coating |
Excellent adhesion to most substrates, direct-write e-beam lithography, T-gate multi layer processes |
MIBK/IPA (1:1 ; 1:2 ; 1:3) |
Microspray |
I-line |
|
spray |
Ideal for irregular surface, complexes topographies, v-groove, vias and other MEMs structures |
MF26A |
*LEGEND : e-beam/ DUV=Deep UV=248nm / I-line: 365nm / g-line : 436nm / h-line : 405nm
PMMA Positive Resists
PMMA (polymethyl methacrylate) is a versatile polymeric material that is well-suited for many imaging and non-imaging microelectronic applications. PMMA resists are simply PMMA polymer dissolved in a solvent like anisole (safe solvent). Exposure causes scission of the polymer chains. PMMA is most commonly used as a high resolution positive resist for direct write e-beam offering extremely high-resolution, ease of handling and excellent film characteristics. PMMA is also used as a protective coating for wafer thinning, as a bonding adhesive and as a sacrificial layer.
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Copolymer resists are based on a mixture of PMMA and ~8.5% methacrylic acid. Copolymer MMA (8.5) MAA is commonly used in combination with PMMA in bi-layer lift-off resist process where independent control of CD size and shape of each resist layer is required. Standard copolymer resists are formulated in ethyl lactate and are available in a wide range of film thicknesses. All MCC PMMA and copolymer resists are available in package sizes from 500ml to 20 liters.
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Schematic of a T-gate illustrating various product layers |
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MicroSpray Photoresist
MicroSpray is a positive acting, aerosol resist, well suited for a broad range of lithographic purposes. This cost effective, easy to use, spray-can eliminates many of the process problems associated with spin coating thick resists and non-planar substrates such as those found in MEMs, Opto-electronics and other non-standard applications.
APPLICATIONS |
PRODUCT ATTRIBUTES |
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