Semiconductor assy

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Standard and emerging semiconductor assembly
Semiconductor and advanced assembly materials (SAAM) are designed to enable a semiconductor chip to communicate with the outside world. We propose a range of solutions used in the manufacture of mobile devices, automotive electronics, avionics, server farms, and power handling for renewable energy sources.

2.5D and 3D chip-stacking • Wafer bumping fluxes • Wafer bumping solder pastes • Copper pillar flip-chip fluxes • Standard flip-chip fluxes Flip-chip • Standard flip-chip fluxes • Wafer bumping and substrate-bumping solder pastes Wafer level CSP ball mount • WL-CSP ball-attach fluxes • Specialty solder spheres Ball-attach • Ball-attach fluxes • Specialty solder spheres Package-on-package and fine-pitch component attach • PoP pastes • PoP fluxes Specialty component attach • Epoxy fluxes

Power semiconductor

Die-attached • Pb and AuSn • Pb free: BiAgX, Sn/Sb, SnAg5... • Forms: Pastes, preforms, spheres, wire, ribbon... Paste and fluxes: • PoP, HF or Halogen • Dip, spray • Flip chip, 2.5D and 3D, ball-attached Silver sintering paste • High temperature joint • Low temperature, low pressure process
There are other specialty assembly materials that are used in a variety of different applications, such as solder spheres, as well as gold-tin and indium-containing solder pastes, wire, and preforms. Read more: http://www.indium.com/semiconductor-and-advanced-assembly/#ixzz2e6PuS5Q2