PRODUCT DESCRIPTION

- NBE’s nanoTach® materials
- Thick paste of silver powder in an organic binder formulation

KEY FEATURES

- Uniform dispersion for screen/stencil printing or dispensing
- Low sintering temperature (< 230oC)
- Excellent sintered properties
- RoHS compliant

APPLICATIONS

- Bonding chips (< 3 mm x 3 mm) for high-power and high-brightness LED lamps, power diode lasers, RF power devices, and power devices.

BENEFITS

- Excellent (>5 times) electrical and thermal joint properties over any soldered or epoxied
- High (>300°C) working temperature
- Superior (>10 times) joint reliability
- Simple processing – low –temperature (<260°C); zero or low pressure (<5 MPa)