Solder Fortification™

The advantages include:

  • Stronger solder joints, which help improve drop test results
  • Increased solder volume compared to what could be achieved with just solder paste
  • Fewer issues with flux residue as the solder-to-flux ratio is increased
  • Reduced rework and other manual processes to add solder volume
  • Elimination of costly or time-consuming processes, such as wave soldering or selective soldering
  • Improved shape and volume of fillet to ensure joints meet IPC specifications

Solder Fortification™ Preforms are rectangle-shaped and are available in tape & reel packaging for easy placement by standard pick and place machines. Available in any alloy to correspond to the solder paste alloy.

Standard sizes:

  • 0201: 0.010" (0.254mm) x 0.020" (0.508mm) x 0.010" (0.254mm)
  • 0402: 0.020" (0.508mm) x 0.040" (1.01mm) x 0.019" (0.48mm)
  • 0603: 0.030" (0.76mm) x 0.060" (1.52mm) x 0.031" (0.787mm)
  • 0805: 0.050" (1.27mm) x 0.080" (2.03mm) x 0.050" (1.27mm)

Pin-in-Paste applications

Preforms can be used as well for Pin in Paste applications

Use of Preform to reduce Voiding

Preforms are an alternative approach to reduce voiding: By using performs you add solder volume without increasing flux (voiding is partially caused by the volatilization of excess flux)
This is especially effective in large areas, such as under QFNs, where gases are easily entrapped.

LV1000 flux coated preforms

With the increased demand for flux coatings that have lower voiding, Indium Corporation has developed the next generation of flux coatings. The LV-Series of flux coatings offers low voiding, especially in situations where the component footprint will not allow for proper outgassing of volatized flux.


  • Low voiding
  • Halogen-free
  • Coatings are uniform and level
  • Durability for pick-and-place equipment
  • Passes Telecordia (Bellcore) testing in activated and unactivated states