Thermabond®
adhesives

- Thermal-mechanical stress decoupling
- Heat transfer path
adhesives

- Developped specifically for power electronics and LED
- Robust adhesion
- Resistant to heat, humidity, and thermal shock
- UL94 V-0 RTI 150°C
- RoHS compliant
- Free of halogen flame retardants
Isolator

- Electrically insulating
- Resistant to heat, humidity and shock
- Conforms to surface topography to maximize contact area at low fastener pressures.
- UL94 V-0 RTI 150˚C
- RoHS compliant
- Free of halogen flame retardants

thermal grease

- RoHS compliant
- Free of halogen flame retardants
gap filler

- Fills large and irregular voids where other thermal interface materials cannot accommodate the topography

 

Thermabond® adhesives  

Thermabond® electronic adhesives are a unique class of elastomeric thermal interface materials that provide thermal-mechanical stress decoupling and a reliable heat transfer path. With Thermabond®, adjoining components move freely during operation, preventing stress build-up created by CTE mismatch. Thermabond® is available in a range of thermal conductivities, including an electrically conductive line for ground plane continuity, ESD grounding, and EMI shielding, and RF shielding.

Properties:

- Bond Reliability: Bonds securely regardless of substrate type, shape, or texture.
- Hot Spot Elimination: Thermal conductivity up to 3 W/mK to transport heat away from hot spots.
- Thermal-Mechanical Stress Decoupling: Low modulus and high shear strength to prevent adhesive delamination.
- Low Temperature Cure Cycle: Thermabond® cure parameters can be as low as 100°C at 100 kPa, so surface mount components can be mounted on the PCB prior to bonding.
- Uniform Bond Line Thickness: Precision calendering produces a uniform adhesive film. Standard thicknesses 0,008” and 0,015”. Minimum Thickness 0,004”.
- Proven Performance: Arlon Thermabond® adhesive products are the gold standard for critical, demanding electronic system applications.

 

 

 
adhesives  

Developed specifically for applications where long-term reliability is a top concern like power electronics end LED. Secure® adhesives form chemical bonds during cure to produce robust adhesion that is resistant to heat, humidity, and thermal shock. Adhesive bonding eliminates the need for mechanical fasteners reducing cost and freeing up space for value added components. S

 
   
Isolator  

Resistant to heat, humidity and shock while conforming to surface topography to maximize contact area at low fastener pressures. Maximizing contact area facilitates even heat transfer to reduce hot spots. 

 

 

 
thermal grease  

Used to mate two surfaces and produce an interface with low thermal resistance so heat is readily transferred from one component to the other. Thermal greases accomplish this by displacing air at the interface and filling voids on the substrates surfaces. Performance is largely driven by the thermal greases ability wet-out the surface and to form a thin bond line. Mate® thermal greases are RoHS compliant and free of halogen flame retardants.

 

 

 
gap filler  

Used to fill large and irregular voids where other thermal interface materials cannot accommodate the topography

 

 

 
Results listed above are typical properties, provided without warranty, expressed or implied, and without liability. Properties may vary, depending on design and application. Arlon reserves the right to change or update these values.