| CTS offers a range of engineering materials customized for a large variety of applications. |
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| Engineered solder preforms |
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- Precise chemistries and physical properties
- Precise dimensions and volume
- Lab-tested and field-proven
- Reliable performance and excellent technical service
- Available in many shapes : disc, washer, square, rectangle and custom shape possible according to the customer drawing.
- Can be deliver coated with flux.
- Delivery in bulk, layer pack, tape and reel.
- Pure indium for low temperature sealing
- Bi-based low-melting alloys for fusible devices
- Indium alloys for step soldering and thermal interfacing
- AuSn alloys for fluxless die-attach and hermatic packaging
- Pb-Free alloys
- All specialty solder alloys, including: SnPb / SnSb / AuGe / AuSn / InPb / InAg / InSn / BiSn / SnAg and many, many more...
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| Solder ribbon |
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| - High quality solder ribbon is available in many standard alloys and sizes. Material can also be custom made to your unique material and dimensional requirements. - Solder ribbon is supplied in continuous lengths and packaged on spools. |
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| New Precision BGA Spheres Optimize Sphere Performance |
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Indium Corporation’s Solder Spheres for PBGA, CBGA, TBGA, µBGA and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accurate diameters.
The solder spheres are available in many alloys including industry standards:
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- Sn63Pb37
- Sn62Pb36Ag2
- Pb90Sn10 |
- Pb89.5Sn10.5
- In 99.99
- Au80.0 Sn20.0 for other applications
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| Thermal Interface Materials |
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| Pure Metal Thermal Interface Materials used in reflow or non-reflow compressible applications. These materials may or may not contain Indium. Products consist of liquid metals at room temperature, Heat-Springs® compressible TIMs, Indium Ribbon and Foil as well as solder preforms and INforms®. |
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