| Spécifiquement concentré sur le traitement de surface et les systèmes de manutentions, Schmid dispose de nombreux type d'équipement de traitement de surface horizontal dont les équipements de finitions étain chimique ou Osp. |
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Process
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| An OSP (Organic Surface Preservative) anti-oxidation layer with a thickness of 0.2 µm - 0.5 µm is applied to the surface of the bare copper. This layer enhances the soldering characteristics on the copper pad and in the drilled holes. The OSP pre-treated end surface guarantees a perfect basis for various, lead-free soldering processes while maintaining the thermal stability. |
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| Features |
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Inline system for OSP coating processes as a protection against oxidation:
- Spray bar, flood bar and flood unit with immersion tray
- Pressure adjustment for top and bottom separately adjustable
- Reduced drag in/out because of squeegee module
- Reduces bath turbulences and foam formation
- Fully automatic dosing controlled by panel counter and area calculator
- Fully automatic cleaning and make-up programs (optional)
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