Oxydation couches internes
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| Oxide replacement |
| Oxide replacement processes, such as Circubond, Multibond, Alpha-Prep, MEC-Etch-Bond etc., promote adhesion of copper and resin during the multilayer lamination process and eliminate the "pink ring" phenomenon. The standard process comprises cleaning, degreasing, conditioning and micro-structuring of the copper surface. |
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| Features |
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Inline system for copper surface conditioning of multi layers
- Fully automatic dosing controlled by area or density calculation
- Batch dosing system for process chemicals
- Multiple cascade rinsing with flood nozzles to remove chemical residues
- Safe transport of very thin inner layer down to 0.025 mm material thickness
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