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CTS offers a large ranges of positive resins for microelectronics applications with
- Excellent adhesion and abrasion resistance
- Excellent coating distribution
- Available in various viscosities
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Name
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Spectre*
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Resolutions
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Application
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Properties
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Developer
and striper
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S1800 G2
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G, H et I
I optimum
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~1 µm
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spin coating
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SPR700
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G, H et I
I optimum
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~1 µm
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spin coating
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High thermal resistance (~130°C)
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SPR220
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G, H et I
I optimum
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~1 µm (1.2)
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spin coating
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- Wet or dry etch
- No cracks on Au, Cu, Ni/Fe
- Fast exposure
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MIF or MIB developer
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SPR955 CM
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G, H et I
I optimum
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~ 0,35 µm
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spin coating
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high line density
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0.24N or 0.26N developer (0.26N recommanded)
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Ultra I123
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I-line
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~0,25µm
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spin coating
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high line density
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0.26N developer
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EXP1620
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I-line
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spray or dip
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- High photo sensitivity
- Flexible for coating on flexible substrates
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160 developer
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SP25
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G, H et I
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spin coating
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160 developer
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SPR505
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G, H et I
I optimum
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< 1 µm
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spin coating
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MF developer
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PMMA
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DUV, e-beam et X-ray
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spin coating
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- T-gate multi layer process
- Excellent adhesion
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- MIBK/IPA (1 :1 ; 1 :2, 1 :3)
- Pure MIBK
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Microspray™
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I-line
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spray
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- Ideal for irregular surface
- Complexes topographies , v-groove, vias and other MEMs structures
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MF26A
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*LEGEND : e-beam/ DUV=Deep UV=248nm / I-line: 365nm / g-line : 405 nm / h-line : 436nm
PMMA Positive Resists
PMMA (polymethyl methacrylate) is a versatile polymeric material that is well-suited for many imaging and non-imaging microelectronic applications. PMMA resists are simply PMMA polymer dissolved in a solvent like anisole (safe solvent). Exposure causes scission of the polymer chains. PMMA is most commonly used as a high resolution positive resist for direct write e-beam offering extremely high-resolution, ease of handling and excellent film characteristics. PMMA is also used as a protective coating for wafer thinning, as a bonding adhesive and as a sacrificial layer.
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Material uses:
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Material attributes:
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• Wafer thinning
• Protective coatings
• PHEMT
• Multi-layer T-gate processes
• Other direct-write e-beam processes
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• Positive tone
• E-beam and X-ray imageable
• Wide range of film thicknesses
• Resist developers and strippers
• Excellent adhesion to most substrates
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Copolymer resists are based on a mixture of PMMA and ~8.5% methacrylic acid. Copolymer MMA (8.5) MAA is commonly used in combination with PMMA in bi-layer lift-off resist process where independent control of CD size and shape of each resist layer is required. Standard copolymer resists are formulated in ethyl lactate and are available in a wide range of film thicknesses. In addition, MMA (17.5) MAA copolymer resists are available upon request. All MCC PMMA and copolymer resists are available in package sizes from 500ml to 20 liters.
| Material uses: |
Material attributes: |
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• Multi-layer T-gate processes
• Other direct write e-beam processes
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• Compatible with multi-layer processes
• Excellent adhesion to most substrates
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MicroSpray™ Photoresist
MicroSpray is a positive acting, aerosol resist, well suited for a broad range of lithographic purposes. This cost effective, easy to use, spray-can eliminates many of the process problems associated with spin coating thick resists and non-planar substrates such as those found in MEMs, Opto-electronics and other non-standard applications.
| APPLICATIONS |
PRODUCT ATTRIBUTES |
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• Conformal coatings
• Ideal for perforated, small, large & irregular shaped substrates
• Backside wafer coatings
• Severe topography, v-grooves, vias & other MEMs structures
• Microfluidic electrophoresis analysis (Lab-on chip)
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• Multi purpose resist product - excellent R&D tool
• Very low cost of ownership - no expensive coating equipment required
• Thick resist coatings demonstrated from 6- 16μm
• Compatible with MIF and metal-ion aqueous developers
• High throughput for thick films
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