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Developing - Etching - Stripping
In a typical inner layer line the non-exposed resist is developed in the developer, the bare copper is sprayed with an acid etching solution in the etching module and removed down to the base material and the resist is stripped off by using an alkaline solution. With outer layers the photo resist is used to define the pattern of an additionally deposited metal resist layer and is removed in the stripper using an alkaline solution. |
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Inline system for processing liquid, dry, ED and metal resists for inner and outer layers
- Development without de-foaming thanks to an optimised bath guidance
- Controlled dosing of the developer solution in the post developer guarantees optimised development processes and reliable removal of unexposed resists
- High etching quality with high etching factor using the FineLine spray system
- Consistent etching structure without "puddle effects" due to intermittent etching with single-nozzle control
- Innovative filter technology for the stripping process adjusted to the type of resist
- Transport systems adaptable to all PCB formats
- Tank station (optional) makes it possible to work with two different chemicals in one machine
- Fully automatic dosing system
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