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LOR - Lift Off Resists for GMR thin film
head, GaAs and etch sensitive application
| LOR A |
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- Superior submicron resolution,
- Superior adhesion to SI, NiFe, permalloy and GaAs,
- Simple bi-level process,
- High yield with broad process window,
- Flexible options optimized to your process,
- Thickness from 3 000 to 60 000 Angstrom,
- Compatible with PGMEA based g-line, i-line, broadband and DUV
imaging resists.
- Compatible with Metal Ion Free MIF developer.
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| LOR B |
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- Superior submicron resolution,
- Superior adhesion to SI, NiFe, permalloy and GaAs,
- Simple bi-level process,
- High yield with broad process window,
- Flexible options optimized to your process,
- Thickness from 3 000 to 60 000 Angstrom,
- Compatible with PGMEA based g-line, i-line, broadband and DUV
imaging resists.
- Compatible with Metal Ion Bearing MIB developer.
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Other products available : Remover PG, Acryl
Strip, EBR PG
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