PAL-Process Automation International Ltd was created in Asia in 1966 from the base Asia Electroplating Co. PAL manufacture vertical surface treatment lines for a variety of Printed Circuit Boards applications. These include :

• Conventional vertical Pattern and Panel lines, 
• Horizontal PTH and platting machines, 
• Electro less and electrolytic Nickel Gold, 
• Desmear and Electro less Copper lines. 

PAL also introduced in 2003, a range of Continuous Vertical Plating machines, especially designed for mixed product and blind via filling applications. PAL also produce rack and barrel plating lines for general metal finishing applications.

Since the company was created, their progress is shown by several land marks :

• 1981, first plating equipment manufactured and installed at Hong Kong,
• 1987, creation of PAL AUTOMATION,
• 1987, first equipment installed in USA,
• 1990, COMPAL design won the "CMA Design" award,
• 1994, opening of the Chinese facility,
• 1996, ISO 9001 certification,
• 1998, delivery of machine SN 1 000 in the world,
• 2003, delivery and installation of a plating line at RUWEL facility with a tank size of 5 750 mm.

PAL AUTOMATION is using sub assembly very well known in Europe and France like Siemens, GF, and so on....

Envoyez un courrier électronique à webmaster@chimietech.com pour toute remarque concernant ce site Web.
Copyright © 2001 - 2008 CHIMIE TECH SERVICES - Version 3.3.0 -  Dernière modification : 13 février 2006