BM2 BM3
  • Single side brushing,

  • Brush diameter 90 mm,

  • Brush rotation speed 1 800 rpm,

  • Brush oscillation (8 mm stroke, 135 oscillations per minute),

  • Working width 400 or 600 mm,

  • Substrate thickness from 0,2 mm to 3,0 mm,

  • Conveyor speed adjustable from 0,2 to 3 meters per minute,

  • Quick brush exchange (3 minutes),

  • Manual adjustment of the brush pressure with indication on a Wattmeter,

  • Operation via push buttons,

  • Integrated rinse,

  • Integrated dryer.

  • Double side brushing,

  • Brush diameter 90 mm,

  • Brush rotation speed 1 800 rpm,

  • Brush oscillation ( 8 mm stroke, 135 oscillations per minute),

  • Working width 400 or 600 mm,

  • Substrate thickness from 0,2 mm to 3,0 mm,

  • Conveyor speed adjustable from 0,2 to 3 meters per minute,

  • Quick brush exchange (3 minutes),

  • Manual adjustment of the brush pressure with indication on a Wattmeter,

  • Operation via push buttons,

  • Integrated rinse,

  • Integrated dryer.

Applications :

  • Printed circuit boards,
  • Ceramic substrate (with optional conveyor for handling minimum subtrate length of 96 mm).
  • Punch hurries,
  • Front plates of devices;
  • Metal plates before chemical treatment or coating.
 
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